From 4823761fb741876fda2fa95ea212ee1ce53dac02 Mon Sep 17 00:00:00 2001
From: ZengTao <2773468879@qq.com>
Date: 星期二, 22 十月 2024 08:59:14 +0800
Subject: [PATCH] 磨边添加进片时清除破损拿走数据

---
 hangzhoumesParent/moduleService/LoadGlassModule/src/main/java/com/mes/engineering/mapper/xml/EngineeringMapper.xml |    5 +++++
 1 files changed, 5 insertions(+), 0 deletions(-)

diff --git a/hangzhoumesParent/moduleService/LoadGlassModule/src/main/java/com/mes/engineering/mapper/xml/EngineeringMapper.xml b/hangzhoumesParent/moduleService/LoadGlassModule/src/main/java/com/mes/engineering/mapper/xml/EngineeringMapper.xml
new file mode 100644
index 0000000..bff1839
--- /dev/null
+++ b/hangzhoumesParent/moduleService/LoadGlassModule/src/main/java/com/mes/engineering/mapper/xml/EngineeringMapper.xml
@@ -0,0 +1,5 @@
+<?xml version="1.0" encoding="UTF-8"?>
+<!DOCTYPE mapper PUBLIC "-//mybatis.org//DTD Mapper 3.0//EN" "http://mybatis.org/dtd/mybatis-3-mapper.dtd">
+<mapper namespace="com.mes.engineering.mapper.EngineeringMapper">
+
+</mapper>

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